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TB6562ANG/AFG
TOSHIBA Bi-CMOS Integrated Circuit Silicon Monolithic
TB6562ANG/AFG
Dual Full-Bridge Driver IC for Stepping Motors
The TB6562ANG/AFG is a 2-phase bipolar stepping motor driver that contains DMOS transistors in the output stage. The driver achieves high efficiency through the use of low ON-resistance DMOS transistors and PWM current control circuitry.
TB6562ANG
Features
2-phase / 1-2-phase / W 1-2-phase excitation PWM current control Power supply voltage: 40 V (max) Output current: 1.5 A (max) Low ON-resistance: 1.5 (upper and lower transistors/typ.) Power-saving function Overcurrent protection: Ilim Thermal shutdown Package: TB6562ANG; SDIP24-P-300-1.78 TB6562ANG; SSOP30-P-375-1.00
SSOP30-P-375-1.00 TB6562AFG
2.5 A (typ.)
TB6562ANG/AFG is lead-free (Pb-free) product. The following conditions apply to solderability: *Solderability 1. Use of Sn-37Pb solder bath *solder bath temperature = 230C *dipping time = 5 seconds *number of times = once *use of R-type flux 2. Use of Sn-3.0Ag-0.5Cu solder bath *solder bath temperature = 245C *dipping time = 5 seconds *number of times = once *use of R-type flux
Weight: SDIP24-P-300-1.78: 1.62 g (typ.) SSOP30-P-375-1.00: 0.63 g (typ.)
This product has a MOS structure and is sensitive to electrostatic discharge. When handling the product, ensure that the environment is protected against electrostatic discharge by using an earth strap, a conductive mat and an ionizer. Ensure also that the ambient temperature and relative humidity are maintained at reasonable levels. Special care should be taken with the following pins, which are vulnerable to surge current. Pins with low surge withstand capability: TB6562ANG: pins 10, 15 TB6562AFG: pins 13, 18
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Block Diagram
Some functional blocks, circuits, or constants may be omitted or simplified in the block diagram for explanatory purposes. < TB6562ANG >
GND 24 Vreg 2 SB 3 OSC 22 OSC Waveform squaring circuit Thermal shutdown Control logic VCC 23 OUT2A 11 Vcc 7 OUT1A 8 OUT2B 14 Vcc 18 OUT1B 17 GND 13
5V
Decoder
1 GND
4 Phase A
5 X1A
6 X2A
21 Phase B
20 X1B
19 X2B
9 VrefA
10 RSA
16 VrefB
15 RSB
12 GND
< TB6562AFG >
GND 30 Vreg 2 SB 3 OSC 28 OSC Waveform squaring circuit Thermal shutdown Control logic VCC 29 OUT2A 14 Vcc 10 OUT1A 11 OUT2B 17 Vcc 21 OUT1B 20 GND 16, 22, 23, 24
5V
Decoder
1 GND
4 Phase A
5 X1A
6 X2A
27 Phase B
26 X1B
25 X2B
12 VrefA
13 RSA
19 VrefB
18 RSB
7, 8, 9, 15 GND
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Pin Description
< TB6562ANG >
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Symbol GND Vreg SB Phase A X1A X2A Vcc OUT1A VrefA RSA OUT2A GND GND OUT2B RSB VrefB OUT1B Vcc X2B X1B Phase B OSC VCC GND Ground pin 5 V output pin Standby pin Rotation direction control pin (Ch. A) Input pin used to set output current level (Ch. A) Input pin used to set output current level (Ch. A) Power supply voltage input pin Output pin 1 (Ch. A) Input pin for external reference voltage (Ch. A) Output current detection resistor connection pin (Ch. A). Output pin 2 (Ch. A) Ground pin Ground pin Output pin 2 (Ch. B) Output current detection resistor connection pin (Ch. B) Input pin for external reference voltage (Ch. B) Output pin 1 (Ch. B) Power supply voltage input pin Input pin used to set output current level (Ch. B) Input pin used to set output current level (Ch. B) Rotation direction control pin (Ch. B) External capacitor pin for triangular-wave oscillation Power supply voltage input pin Ground pin VCC (opr) = 10 V to 34 V Connect to a motor coil pin. Vcc (opr) = 10 V to 34 V Apply a 0 V / 5 V signal, Built-in pull down resistance of 100k Apply a 0 V / 5 V signal, Built-in pull down resistance of 100k Apply a 0 V / 5 V signal, Built-in pull down resistance of 100k (typ.) (typ.) (typ.) Connect to a motor coil pin. Connect to a motor coil pin. Connect a capacitor between this pin and the GND pin. H: start, L: Standby, Built-in pull down resistance of 100k (typ.) (typ.) (typ.) (typ.) Function Description Remarks
Apply a 0 V / 5 V signal, Built-in pull down resistance of 100k Apply a 0 V / 5 V signal, Built-in pull down resistance of 100k Apply a 0 V / 5 V signal, Built-in pull down resistance of 100k Vcc (opr) = 10 V to 34 V Connect to a motor coil pin.
TB6562ANG
GND Vreg SB Phase A X1A X2A Vcc OUT1A VrefA RSA OUT2A GND GND Vcc OSC Phase B X1B X2B Vcc OUT1B VrefB RSB OUT2B GND

GND Vreg SB Phase A X1A X2A GND GND GND Vcc OUT1A VrefA RSA OUT2A GND
TB6562AFG
GND Vcc OSC Phase B X1B X2B GND GND GND Vcc OUT1B VrefB RSB OUT2B GND
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< TB6562AFG >
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Symbol GND Vreg SB Phase A X1A X2A GND GND GND Vcc OUT1A VrefA RSA OUT2A GND GND OUT2B RSB VrefB OUT1B Vcc GND GND GND X2B X1B Phase B OSC VCC GND Ground pin 5 V output pin Standby pin Rotation direction control pin (Ch. A) Input pin used to set output current level (Ch. A) Input pin used to set output current level (Ch. A) Ground pin Ground pin Ground pin Power supply voltage input pin Output pin 1 (Ch. A) Reference voltage external set pin (Ch. A) Resistance connect pin for detecting output current (Ch. A) Output pin 2 (Ch. A) Ground pin Ground pin Output pin 2 (Ch. B) Output current detection resistor connection pin (Ch. B) Input pin for external reference voltage (Ch. B) Output pin 1 (Ch. B) Power supply voltage input pin Ground pin Ground pin Ground pin Input pin used to set output current level (Ch. B) Input pin used to set output current level (Ch. B) Rotation direction control pin (Ch. B) External capacitor pin for triangular-wave oscillation Power supply voltage input pin Ground pin VCC (opr) = 10 V to 34 V Apply a 0 V / 5 V signal, Built-in pull down resistance of 100k (typ.) Apply a 0 V / 5 V signal, Built-in pull down resistance of 100k (typ.) Apply a 0 V / 5 V signal, Built-in pull down resistance of 100k (typ.) Connect to a motor coil pin. Vcc (opr) = 10 V to 34 V Connect to a motor coil pin. Connect to a motor coil pin. Vcc (opr) = 10 V to 34 V Connect to a motor coil pin. Connect a capacitor between this pin and the GND pin. H: start, L: Standby, Built-in pull down resistance of 100k (typ.) Apply a 0 V / 5 V signal, Built-in pull down resistance of 100k (typ.) Apply a 0 V / 5 V signal, Built-in pull down resistance of 100k (typ.) Apply a 0 V / 5 V signal, Built-in pull down resistance of 100k (typ.) Function Description Remarks
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Absolute Maximum Ratings (Ta = 25C)
Characteristic Power supply voltage Output voltage Output current Input voltage Power dissipation Operating temperature Storage temperature Junction temperature Symbol VCC Vo IO (Peak) Vin PD Topr Tstg Tjmax Rating 40 40 1.5 (Note 1) -0.2 to 5.5 2.5 (Note 2) -20 to 85 -55 to 150 150 Unit V V A V W C C C
Note 1: Output current may be controlled by excitation mode, ambient temperature, or heatsink. When designing a circuit, ensure that the maximum junction temperature, TjMAX = 150C, is not exceeded when the IC is used. Avoid using the IC in abnormal conditions that would cause the Tj to exceed 150C, even though the heat protection circuit of the IC will continue to operate in such conditions. Note 2: When mounted on a board (50 mm x 50 mm x 1.6 mm, Cu area: 50%) The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must not be exceeded during operation, even for an instant. If any of these ratings are exceeded during operation, the electrical characteristics of the device may be irreparably altered, in which case the reliability and lifetime of the device can no longer be guaranteed. Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation in other equipment. Applications using the device should be designed so that no maximum rating will ever be exceeded under any operating condition. Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set forth in this document.
Operating Range (Ta = -20 to 85C)
Characteristic Power supply voltage Input voltage Vref voltage PWM frequency Triangular-wave oscillation frequency Symbol VCC Vin Vref fpwm fosc Rating 10 to 34 0 to 5 0.5 to 7.0 15 to 80 45 to 400 Unit V V V kHz kHz
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Electrical Characteristics (VCC = 24 V, Ta = 25C)
Characteristic Symbol ICC1 Supply current Test Circuit Test Condition XT1A = XT2A = H, XT1B = XT2B = H Output = Open XT1A = XT2A = L, XT1B = XT2B = L Output = Open Standby mode VIN = 5 V VIN = 0 V (Target spec.) VIN = 5 V VIN = 0 V IO = 0.2 A IO = 1.5 A VCC = 40 V VCC = 40 V IO = 1.5 A IO = 1.5 A 1 mA Vref = 0.5 V X1 = X2 = L Vref = 5 V X1 = L, X2 = H Vref = 5 V X1 = H, X2 = L Vref 5V (Target spec.) Min Typ. 6.5 Max 10 mA Unit
ICC2 ICC3
2 -0.2 30 2.3 -0.2 30 4.75 0.45
7.0 2.0 0.4 50 0.4 50 1.5 1.5 1.3 1.3 5 5 0.5
12 4.0 5.5 0.8 75 5 5.5 0.8 75 5 2.0 2.0 10 10 2.0 2.0 5.25 10 0.55
Input voltage Control circuit (Note 1) Input hysteresis voltage Input current
VINH VINL VIN (HYS) IINH IINL VINSH VINSL VIN (HYS) IINSH IINSL Ron (U + L) IL (U) IL (L) VF (U) VF (L) Vreg Iref Vref (1/10)
V
A
Input voltage Standby circuit Input hysteresis voltage Input current

V
A
Output ON-resistance
Output leakage current
A
Diode forward voltage Internal reference voltage Input current

V V A
Vref circuit
Current limit voltage
Vref (1/15)
0.28
0.33
0.38
V
Vref (1/30) Triangular-wave oscillation frequency Thermal shutdown circuit operating temperature fosc TSD

0.12 88
0.17 110 160
0.22 132 kHz C
C = 4700 pF (Target spec.)
Note 1: Phase, X1 and X2 pins
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Truth Tables
< 2-phase excitation > (*) Io: OUT1
Phase A Input Phase A H L L H X1A L L L L X2A L L L L Output IO(A) 100% -100% -100% 100% Phase B H H L L Input X1B L L L L X2B L L L L
OUT2; + current
OUT2
OUT1;
Phase B
current
Output IO (B) 100% 100% -100% -100%
< 1-2-phase excitation >
Phase A Input Phase A H X L L L X H H X1A L H L L L H L L X2A L H L L L H L L Output IO (A) 100% 0% -100% -100% -100% 0% 100% 100% Phase B H H H X L L L X Input X1B L L L H L L L H X2B L L L H L L L H Phase B Output IO (B) 100% 100% 100% 0% -100% -100% -100% 0%
< W 1-2-phase excitation >
Phase A Input Phase A X H H H H H H H X L L L L L L L X1A H H L L L L H L H H L L L L L H X2A H L H L L L L H H L H L L L H L Output IO (A) 0% 33.3% 66.7% 100% 100% 100% 33.3% 66.7% 0% -33.3% -66.7% -100% -100% -100% -66.7% -33.3% Phase B L L L L X H H H H H H H X L L L Phase B Input X1B L L L H H H L L L L L H H H L L X2B L L H L H L H L L L H L H L H L Output IO (B) -100% -100% -66.7% -33.3% 0% 33.3% 66.7% 100% 100% 100% 66.7% 33.3% 0% -33.3% -66.7% -100%
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Timing Charts
Timing charts may be simplified for explanatory purposes. < 2-phase excitation >
100 -100 100 -100 H L X1A H L H L H L H L H L
IO (A)
IO (B)
Phase A
X2A
Phase B
X1B
X2B
(*) Io: OUT1 OUT2; + current < 1-2-phase excitation >
100 IO (A) 0% -100 100 IO (B) 0% -100 Phase A H L X1A H L H L H L H L H L
OUT2 OUT1;
current
X2A
Phase B
X1B
X2B
(*) Io: OUT1 OUT2; + current
OUT2 OUT1;
current
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< W 1-2-phase excitation >
100 66.7% 33.3% IO (A) 0% -33.3 -66.7% -100% 100 66.7% 33.3% IO (B) 0% -33.3 -66.7% -100%
Phase A
H L
X1A
H L H L H L H L H L
X2A
Phase B
X1B
X2B
(*) Io: OUT1 OUT2; + current
OUT2 OUT1;
current
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PWM Current Control
The IC enters CW (CCW) mode and short brake mode alternately during PWM current control. To prevent shoot-through current caused by simultaneous conduction of upper and lower transistors in the output stage, a dead time is internally generated for 300 ns (target spec) when the upper and lower transistors are being switched. Therefore synchronous rectification for high efficiency in PWM current control can be achieved without an off-time generated via an external input. Even for toggling between CW and CCW modes, and CW (CCW) and short brake modes, no off-time is required due to the internally generated dead time.
VCC
VCC
VCC
OUT1
M
OUT1
M
OUT1
M
RS
RS
RS
PWM ON t1
PWM ON OFF t2 = 300 ns (typ.) VCC
PWM OFF t3 VCC
OUT1
M
OUT1
M
RS PWM OFF ON t4 = 300 ns (typ.) PWM ON t5
RS
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Constant current regulation When VRS reaches the reference voltage (Vref), the IC enters discharge mode. After four clock signals are generated from the oscillator, the IC moves from discharge mode to charge mode.
Vref
VRS
OSC Internal clock Vref VRS
Discharge GND
Charge
Discharge
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Transition from charge mode to discharge mode If VRS > Vref after four clock signals in charge mode, the IC again enters discharge mode. After a further four clock signals in discharge mode, VRS is compared with Vref. If VRS < Vref, the IC operates in charge mode until VRS reaches Vref.
OSC Internal clock Vref VRS
Discharge Charge GND
Discharge
Charge
Transition from discharge mode to charge mode Even when the reference voltage has risen, discharge mode lasts for four clock signals and is then toggled to charge mode.
OSC Internal clock
Vref
VRS
Discharge
Charge
Discharge
GND
Timing charts may be simplified for explanatory purposes.
Internal oscillation frequency (fosc)
The internal oscillation frequency is approximated by the formula below: osc = 1 / (0.523 x (Cosc x 3700 Cosc x 600)).
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Reference Voltage Generator
The current value at 100% is determined by applying voltage at the Vref pin. The value can be calculated as follows: IO (100 ) = Vref x 1/10 x 1/RS[A] (X1 = X2 = L)
VCC Control circuit OUT1 M IO OUT2 Decoder X1 X2
1/10 1/15 1/30 RS IO
Vref
Thermal Shutdown Circuit (TSD)
The IC incorporates a thermal shutdown circuit. When the junction temperature (Tj) reaches 160C (typ.), the output transistors are turned off. After 50 s (typ.), the output transistors are turned on automatically. The IC has 40C temperature hysteresis. TSD = 160C (target spec) TSD = 40C (target spec)
Overcurrent Protection Circuit (ISD)
The IC incorporates an overcurrent protection circuit to detect voltage flowing through the output transistors. The overcurrent threshold is 2.5 A (typ.). Currents flowing through the eight output transistors are monitored individually. If overcurrent is detected in at least one of the transistors, all transistors are turned off. The IC incorporates a timer to count the 50 s (typ.) for which the transistors are off. After the 50 s, the transistors are turned on automatically. If an overcurrent occurs again, the same operation is repeated. To prevent false detection due to glitches, the circuit turns off the transistors only when current exceeding the overcurrent threshold flows for 10 s or longer.
ILIM Output current 0 50 s (typ.) 10 s (typ.) Not detected 10 s (typ.) 50 s (typ.)
The target specification for the overcurrent limiter value (overcurrent threshold) is 2.5 A (typ.), and varies in a range from approximately 1.5 A to 3.5 A. These protection functions are intended only as a temporary means of preventing output short circuits or other abnormal conditions and are not guaranteed to prevent damage to the IC. If the guaranteed operating ranges of this product are exceeded, these protection features may not operate and some output short circuits may result in the IC being damaged. The overcurrent protection feature is intended to protect the IC from temporary short circuits only. Short circuits persisting over long periods may cause excessive stress and damage the IC. Systems should be configured so that any overcurrent condition will be eliminated as soon as possible.
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Application Circuit
The application circuit below is for reference only and requires thorough evaluation at the mass production design stage. In furnishing this example of an application circuit, Toshiba does not grant the use of any industrial property rights.
(Note 2) C3 C2 5V (Note 4) (Note 1) 24 V Stepping motor R1 R1 TB6562ANG/AFG OUT1B 20 OUT2B 17 RSB 18 VrefA 12 DAC output signal C4 R2 VrefB 19 GND 1, 7, 8, 9, 15, 16, 22, 23 24, 30 C1 10 VCC 21 Vcc 29 Vcc OUT1A 11 OUT2A 14 RSA 13
VDD PORT1 PORT2 PORT3 PORT4 PORT5 PORT6 PORT7 PORT8 GND PORT9 3 SB
2 Vreg
28 OSC
4 Phase A 5 XA1 6 XA2 27 Phase B 26 XB1 25 XB2
Note 1: A power supply capacitor should be connected between VCC and RSA (RSB), and as close as possible to the IC. Note 2: C2 and C3 should be connected as close as possible to S-GND. Note 3: In powering on, set the IC as follows: SB = Low (standby mode) or XA1 = XA2 = XB1 = XB2 = High (current value = 0%)
Note 4: When the Vref is being changed, a DAC output can be connected directly to the Vref pin. Note 5: The VCC pins (pin 10, pin 21, pin 29) should be shorted externally. Note 6: Connect the capacitor C4 to the Vref to reduce the switching noise.
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Package Dimensions
Weight: 1.62 g (typ.)
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Weight: 0.63 g (typ.)
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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. Timing charts may be simplified for explanatory purposes. The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
2. Equivalent Circuits
3. Timing Charts
4. Application Circuits
5. Test Circuits
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.
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Points to remember on handling of ICs
(1) Over current Protection Circuit Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the Over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. (2) Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. (3) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (4) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor's power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.
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RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice. 021023_D
070122EBA_R6
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. 021023_A * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. 021023_B * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. 070122_C * Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 060819_AF * The products described in this document are subject to foreign exchange and foreign trade control laws. 060925_E
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